KEMET DS 6, 9, 12 SERIES WITH ANALOGUE CONTROL LAPPING & POLISHING MACHINES

Kemet Dual Face Machines grind, lap & polish both flat faces of the components at the same time.
 Able to process a wide range of materials and achieve very tight tolerance and consistently
 5 carriers are driven for smooth action when grinding or lapping fragile parts 
  • Plate and carrier speeds variable through AC frequency 
  • Custom Fine Grinding, Grinding or Lapping plates are available for optimum
  • Optional
    • Automatic Thickness Control
    • Load Cell Pressure Control
    • HMI Touch Panel Control
Typical Applications
  • Sapphire Wafers
  • Silicon Wafers
  • Precision Optics
  • Filter Glass
  • Sapphire Watch Glass
  • Quartz Crystals
  • Disk Drives Components