KEMET DS 6, 9, 12 SERIES WITH HMI CONTROL LAPPING & POLISHING MACHINES

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Kemet Dual Face Machines grind, lap & polish both flat faces of the components at the same time.

 Able to process a wide range of materials and achieve very tight tolerance and consistently

 5 carriers are driven for smooth action when grinding or lapping fragile parts 

  • Plate and carrier speeds variable through AC frequency 
  • Custom Fine Grinding, Grinding or Lapping plates are available for optimum 
  • Optional
    • Automatic Thickness Control
    • Load Cell Pressure Control
    • HMI Touch Panel Control 

Typical Applications

  • Sapphire Wafers
  • Silicon Wafers
  • Precision Optics
  • Filter Glass
  • Sapphire Watch Glass
  • Quartz Crystals
  • Disk Drives Components

DS 6-9-12 Specs