Type OS Diamond Compound/Diamond Paste

Kemet Diamond Compound OS is specially developed for use on hard materials such as Tungsten carbide, hardened steels and ceramics.

The high thermal stability of the chemical carrier ensures that Kemet Diamond Compound resists frictional heat, remains stable and keeps its suspension properties under operating conditions

Available from 1/10 micron to 90 micron in a range of diamond concentrations from C1 (lowest) to C4 (highest).  Packaging sizes range from 5g, 10g and 20g. Over sizes available on request.  You can see the full range by opening the datasheet below

Type OS Diamond Compound Datasheet (0.1MB)

Diamond Paste Type KD
Diamond Compound Stick
Type L Diamond Compound & Diamond Paste
Type OS Diamond Compound/Diamond Paste
Type W Diamond Compound & Diamond Paste
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